❯ CXMT starts mass production of its fifth-generation platform at an 11.95nm active-area half-pitch

in productionCXMT announced at the 2026 World Manufacturing Conference that its fifth-generation technology platform has entered mass production. Per the company’s published figures, quad-patterning brings the memory array’s active-area half-pitch to 11.95 nanometers, with a storage capacitor aspect ratio of 45:1 and the core functional area height reduced to 6,762 nanometers — approaching, the company says, the world’s most advanced memory production platforms.

the output numberThe more useful figure for the industry is a different one: wafer output improved more than 50% over the previous generation under comparable conditions. The 24GB LPDDR5X built on this platform is already in mass production and has entered the domestic flagship smartphone supply chain in full. Until now this company’s news flow was mostly about HBM3E risk production; this is the first time it has put the full process parameters of a base DRAM platform on the table.

supply implicationsDensity and per-wafer output rising together changes the supply curve for Chinese memory, not just the spec sheet. With global memory in a cycle where AI demand squeezes consumer supply, a domestic platform yielding 50% more per wafer relieves handset makers’ cost pressure first. What to watch next is when this platform gets applied to HBM base dies — that is where it actually connects to AI compute.

▪ SIGNALFifty percent more output per wafer says more about where Chinese memory now sits than the 11.95nm figure does.