IT之家 reports CMC launches Primo Matrix plasma wafer dicing tool and ships first unit to a domestic packaging customer

According to IT之家, CMC recently released its Primo Matrix dual-station plasma wafer dicing system and said the first unit has been delivered to an important domestic integrated-circuit packaging customer. The tool is aimed at advanced packaging, where high precision, low damage and narrow dicing streets are critical. CMC says Primo Matrix supports 200 mm and 300 mm wafers, dicing streets down to 5 μm, and wafer thicknesses from 25 to 700 μm.