IT之家: Tsinghua Unigroup and BAIC open joint innovation center for automotive chips

According to IT之家, Tsinghua Unigroup and BAIC Group held a ceremony in Beijing on November 12 to unveil a joint innovation center and sign a deeper cooperation agreement. The two sides plan to work together on SoC chips, domain controllers for cockpit and driving systems, smart cockpits, and smart chassis control. Unigroup unit Unisoc Tongxin and BAIC’s research institute also signed a strategic agreement to jointly develop an advanced automotive-grade cockpit-driving integrated SoC. They said the goal is to speed up deployment in vehicle applications.