IT Home says Huawei’s Kirin account details the Kirin 9050 series with a 140% AI compute boost

According to IT Home, Huawei’s Kirin official account posted details on the Kirin 9050 series, calling it the first “logic-folding” τ chip. The series is said to upgrade eight core units covering computing, AI, graphics, imaging, communications, audio-video, display and security. Huawei’s figures cited by IT Home say the chips use more than 50 million hybrid bonds and over 5 million effective signal interconnects, with transistor density up 53.5%. The Kirin 9050 Pro integrates Lingxi CPU, Maliang GPU and a Da Vinci NPU.