NVIDIA describes an AI-defined fab for faster semiconductor engineering

NVIDIA described AI applications in semiconductor fabs spanning engineering simulations, process prediction and testing factory changes in virtual environments. According to the company, COMSOL uses cuDSS to accelerate multiphysics simulations by up to 10x, while Applied Materials uses PhysicsNeMo to accelerate topography simulations by up to 35x. Siemens is integrating cuLitho into its Calibre lithography software, delivering up to 17x acceleration on key simulation workloads. The faster calculations allow engineers to verify more before a wafer goes to print.